#12 Water Soluble Flux Part Number: 25-12
DESCRIPTION: # 12 Water Soluble Core Flux is a non Resinous Organic Flux designed to be used with water cleaning process. # 12 Organic wire flux is a unique formulation incorporating fast acting chemical components to provide maximum solderability, even with difficult to solder metals and surface finishes. Electrical and Electronic assemblies can be soldered with this flux very efficiently. Flux residues are considered hygroscopic and corrosive and every attempt must be made to remove the flux residue from the assemblies completely after the soldering operation.
APPLICATION AND USES: # 12 Water Soluble Core Flux is designed to be used in manufacturing water soluble core-wire solder alloys by extrusion processes. # 12 is excellent in solderability and the residue is easily removable by water washing. It is compatible with liquid water soluble fluxes used in soldering electronic assemblies.
#25 Flux Part Number: 25-25
DESCRIPTION: # 25 Core Wire Flux is an RA type core flux specifically formulated for manufacturing RA type core wire solders. # 25 Core Solder Flux is formulated to meet the requirements of J-std and IPC specifications type ROL1. This flux is designed to meet the requirements of many electronic soldering assembly applications and provides increased solderability. # 25 core solder flux is an activated rosin type flux and the residue can be removed by solvent cleaning or by samponification cleaning.
APPLICATION AND USES: # 25 Core Flux can be applied to Core wire during solder extrusion. Flux content of any percentage can be manufactured with # 25 Core Flux. # 25 Core Flux is used for applications where organic flux residue is too corrosive and a safe rosin flux provides better fluxing action with increased reliability.
#32 Flux Part Number: 25-32
DESCRIPTION: # 32 Core Wire Flux is an RMA type core flux specifically formulated for manufacturing RMA type core wire solders. # 32 Core Solder Flux is formulated to meet the requirements of J-std and IPC specifications. This flux is carefully formulated to maintain highly effective fluxing and wetting properties and still meet the test requirements of an RMA category. A proprietary chemical system significantly improves flux performance, yet flux residues are classified as non-corrosive and non-conductive.
APPLICATION AND USES: # 32 Core Flux can be applied to Core wire during solder extrusion. Flux content of any percentage can be manufactured with # 32 Core Flux. # 32 Core Flux is used for applications where organic flux or RA type rosin flux residues are too corrosive.
#53 & #56 Fluxes Part Number: 25-53, 25-56
DESCRIPTION: # 53 and # 56 Core Wire Fluxes are RA type core fluxes specifically formulated for manufacturing RA type core wire solders. # 53 and # 56 Core Solder Fluxes are formulated to meet the requirements of J-std and IPC specifications ROM1. # 53 and # 56 Core Solder Fluxes are formulated to higher activator levels than our # 25 core wire flux. These fluxes are designed to meet the requirements of many electronic soldering assembly applications and provide increased solderability. # 53 and # 56 core solder fluxes are activated rosin type fluxes and the residue can be removed by solvent cleaning or by samponification cleaning.
APPLICATION AND USES: # 53 and # 56 Core Fluxes can be applied to cored wire during solder extrusion. Flux content of any percentage can be manufactured with these fluxes. # 53 and #56 Core Fluxes are used for applications where organic flux residue is too corrosive and a safe rosin flux provides better fluxing action with increased reliability.
#61 No-Clean Flux Part Number: 25-61
DESCRIPTION: # 61 No-CLEAN Core Wire Flux is a no-clean type core flux for manufacturing no-clean flux cored solder wire. # 61 core flux is formulated to meet the requirements specified in J-standard and Bellcore specifications on soldering fluxes. # 61 core flux is halide free which permits leaving the flux residue on the assembly for many applications. This flux has been developed for use in the electronics industry for no-clean soldering applications. The fluxing ability of # 61 no-clean halide-free core flux is greater than most RMA type fluxes.
APPLICATION AND USES: # 61 No-Clean Core Flux has been developed for manufacturing no-clean type core solder wire. Its unique melting range and solidification temperature is compatible with conditions in solder extrusion. A flux percentage of 0.8 to 1.2 percent by weight is normally recommended for no-clean solder wire. The flux residue is considered non-conductive and non-corrosive after soldering. No cleaning is required in most applications.